Figure 3 from Effect of Ni on the Formation of ${\hbox {Cu}}_{6}{\hbox {Sn}}_{5}$ and ${\hbox {Cu}}_{3}{\hbox {Sn}}$ Intermetallics | Semantic Scholar
Comparative study of Au–Sn and Sn–Ag–Cu as die‐attach materials for power electronics applications - Lee - 2016 - Surface and Interface Analysis - Wiley Online Library
The Microstructure of Eutectic Au-Sn and In-Sn Solders on Au/Ti and Au/Ni Metallizations during Laser Solder Bonding Process for Optical Fiber Alignment | Semantic Scholar
a) Interface of Cu/SnAg in Au/Ni/Cu-SnAg-Cu solder joint after aging... | Download Scientific Diagram
Collection of Phase Diagrams
Molex, 39-00-0074, Mini-Fit Female Crimp Terminal, Selective Gold (Au) and Selective Tin (Sn) Over Nickel (Ni), 18-24 AWG, Loose: Amazon.com: Industrial & Scientific
Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging | SpringerLink
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications | SpringerLink
Thermally stable Ni/Au–Sn/Ni joint fabricated via transient liquid-phase bonding - ScienceDirect
Zn Metal AI Mn Zn Cr Ga Cd Ni Sn Cu Ag Pt Your | Chegg.com
The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au - UNT Digital Library
Metals | Free Full-Text | Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics
Comparative study of Au–Sn and Sn–Ag–Cu as die‐attach materials for power electronics applications - Lee - 2016 - Surface and Interface Analysis - Wiley Online Library
Influence of temperature on the soldering process of CLCC-3 package components using AuSn20 solder
Microstructural evolutions of Cu(Ni)/AuSn/Ni joints during reflow - ScienceDirect
Thermodynamic reassessment of Au–Ni–Sn ternary system - ScienceDirect
The Au/Ni/Cu interfaces in the joints with a solder ball diameter of... | Download Scientific Diagram
a) Au-Sn binary phase diagram; (b) SEM image of the AuSn TLP bond;... | Download Scientific Diagram
THE MICROSTRUCTURE OF EUTECTIC AU-SN SOLDER BUMPS ON CU/ELECTROLESS NI/AU
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method | Semantic Scholar
![The isothermal section of Au–Ni–Sn phase diagram at room temperature [28] | Download Scientific Diagram](https://www.researchgate.net/publication/340257866/figure/fig13/AS:941666877861888@1601522287025/The-isothermal-section-of-Au-Ni-Sn-phase-diagram-at-room-temperature-28.png "The isothermal section of Au–Ni–Sn phase diagram at room temperature [28] | Download Scientific Diagram")
The isothermal section of Au–Ni–Sn phase diagram at room temperature [28] | Download Scientific Diagram
Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and A
Comparative study of Au–Sn and Sn–Ag–Cu as die‐attach materials for power electronics applications - Lee - 2016 - Surface and Interface Analysis - Wiley Online Library
