a Cu–Ni–Sn isotherm phase diagram at 240 °C and the diffusion paths for... | Download Scientific Diagram
Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders | Journal of Materials Research | Cambridge Core
A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding - ScienceDirect