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Phase equilibria, formation, crystal and electronic structure of ternary compounds in Ti–Ni–Sn and Ti–Ni–Sb ternary systems - ScienceDirect
Database Manual_PanNoble2023
Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules | SpringerLink
Materials | Free Full-Text | A High-Throughput Search for Composition–Phase–Property Relations of Cu–Ni/Ti–Al Elastic Copper Alloys
![PDF] Classification of Bulk Metallic Glasses by Atomic Size Difference, Heat of Mixing and Period of Constituent Elements and Its Application to Characterization of the Main Alloying Element | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/4c4ed42eee888239a82837ecc0e361772211d6b5/7-Figure3-1.png "PDF] Classification of Bulk Metallic Glasses by Atomic Size Difference, Heat of Mixing and Period of Constituent Elements and Its Application to Characterization of the Main Alloying Element | Semantic Scholar")
PDF] Classification of Bulk Metallic Glasses by Atomic Size Difference, Heat of Mixing and Period of Constituent Elements and Its Application to Characterization of the Main Alloying Element | Semantic Scholar
Cu-Sn Phase Diagram & Computational Thermodynamics
applied sciences
Design and development of novel antibacterial Ti-Ni-Cu shape memory alloys for biomedical application | Scientific Reports
Cu-Based Shape Memory Alloys: Modified Structures and Their Related Properties | IntechOpen
Nonferrous Metals | PDF | Heat Treating | Alloy
NT0408 Ti-Ni-Cu & Ti-Ni-Nb Shape Memory Alloy | Refractory Metals and Alloys
Improvement of Thermoplastic Forming Ability of Ti–Zr–Ni–Cu Metallic Glass by Addition of Sn | SpringerLink
Metal Distributions, Efficient n-Type Doping, and Evidence for in-Gap States in TiNiMySn (M = Co, Ni, Cu) half-Heusler Nanocomposites | Chemistry of Materials
Design and development of novel antibacterial Ti-Ni-Cu shape memory alloys for biomedical application | Scientific Reports
Density of State for (a) Ti-Ni termination, (b) Ti-Sn termination, and... | Download Scientific Diagram
Materials | Free Full-Text | High-ZT Due to the Influence of Copper in Ti (Ni1-xCux)Sn
Element 10mm Cube Set 15 PCS - 95.0-99.95% Purity W Mo Nb Ti Ni Cu Al Fe Zr Bi Sb Y Cr C Sn, with Display: Amazon.com: Industrial & Scientific
Improvement of Thermoplastic Forming Ability of Ti–Zr–Ni–Cu Metallic Glass by Addition of Sn | SpringerLink
Morphological and Mechanical Behaviour of Cu–Sn Alloys—A review | SpringerLink
Phase stability and property evolution of biphasic Ti–Ni–Sn alloys for use in thermoelectric applications
Figure 1 from Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization | Semantic Scholar
Ni-Sn phase diagram. 6 | Download Scientific Diagram
IJMMME - Solid-Liquid Interdiffusion Bonding between Ti/Ni/Ag/Sn Backside Metallized Si Chips and Cu/Al<sub>2</sub>O<sub>3</sub> - DBC Substrates with Au/Pd/Ni Surface Finish
